Low-Power, Flexible Sensor Arrays with Solderless Board-to-Board Connectors for Monitoring Soil Deformation and Temperature
Journal Article
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| Year of Publication |
2022
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| Author | |
| Journal |
Sensors
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| Volume |
22
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| Issue |
7
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| Number of Pages |
2814
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| Date Published |
Jan-04-2022
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| DOI |
10.3390/s22072814
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| Download citation |